http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2043139-A2

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publicationDate 2009-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-2043139-A2
titleOfInvention Method of preventing etch profile bending and bowing in high aspect ratio openings by treating a polymer formed on the opening sidewalls
abstract High aspect ratio contact openings are etched while preventing bowing or bending of the etch profile by forming a highly conductive thin film on the side wall of each contact opening. The conductivity of the thin film on the side wall is enhanced by ion bombardment carried out periodically during the etch process.
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Total number of triples: 31.