| abstract |
The invention provides a thermoplastic resin composition which has high rigidity and high flowability, gives less peeling of molding surface, and provides excellent appearance, and which can be suitably used for mechanical parts of automobile and mechanical parts of electrical and electronic products. Provided is the thermoplastic resin composition comprising: 100 parts by weight of (A) a sole polybenzimidazole resin or a mixed thermoplastic resin composed of 70 to 20% by weight of a polybenzimidazole resin and 30 to 80% by weight of a polyether ketone resin; and 5 to 100 parts by weight of (B) a liquid crystalline polyester amide resin containing one or more types of structuring monomer of 4-aminophenol, 1,4-phenylenediamine, 4-aminobenzoic acid, and a derivative thereof, and containing 3 to 35% by mole of an amide component in the total bonds. |