| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_87601f67652231739bdbad18d86703d2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0083
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-30 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0093
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-20 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-42 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-00 |
| filingDate |
2007-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2008-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2003702-A1 |
| titleOfInvention |
Semiconductor light emitting device and method of fabricating the same |
| abstract |
The present invention provides a flip chip semiconductor light-emittingdevice which includes a substrate and a semiconductor multi-layer structure. The semiconductor multi-layer structure has a first surface and a second surface in opposition to the first surface. The semiconductor multi-layer structure is bonded to the substrate by the first surface. In addition, the second surface has a plurality of convex. More particularly, the plurality of convex is arranged in a periodic structure. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102117871-A |
| priorityDate |
2007-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |