| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33c922e05f6133b7d72dbb849d77487d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-22 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321 |
| filingDate |
2007-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_491ad46815173d237dc563186fc0be82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cada59de3614cabfb7448851e16544ee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ebbd82b7bcc31ec522588c9bd27676f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf4b475193cd8c88f7cc297ea888af82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30a989e796bcb6b87339688b60d64c99 |
| publicationDate |
2018-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1994112-B1 |
| titleOfInvention |
Cmp slurry and method for polishing semiconductor wafer using the same |
| priorityDate |
2006-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |