| abstract |
An object of the present invention is to provide a resin composition having high optical transparency, and excellent heat resistance, light resistance and mechanical properties when it cures. To attain the object, a heat or photo-curable resin composition comprises: (A) a low molecular wight acrylic resin obtained by carrying out a polymerization of (a) an epoxy group-containing (meth)acrylate and (b) an unsaturated compound having one polymerizable unsaturated bond in the molecule to obtain a copolymer having a weight average molecular weight of 1,000 to 10,000, and then reacting the copolymer with (c) an unsaturated carboxyl acid; a heat or photo-polymerizable monomer having at least one heat or photo curable unsaturated double bond in the molecule; and (C) a radical polymerization initiator. |