| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_421f6f8fd79c2632ebff77c570dce2e8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6f0f795b474ba632e49277e4cbe793b5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-3213
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-3227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-3225 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B35-645
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B35-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B35-505
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-60 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C33-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B35-50 |
| filingDate |
2006-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_119b4f059536ea0c193520f4532765cc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de4c3c5876a5ae959c1b4a05dfffc874
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e5daff2a4023a4303a99c7cfe48bd4d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7098f55038462b6d4e6368c18de5f116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f01072ff11fb952079e482ed3fc8e84
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ec07d4721b89cd4f3baa5f89408a2a4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1dc9200b6963f28f3198ec30e6340ac0 |
| publicationDate |
2008-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1978005-A1 |
| titleOfInvention |
Low-adhesion material, molds for molding resins, and stainproof material |
| abstract |
A resin molding die (1) has a molding surface (6) formed of a low adhesion material (3) formed of a solid solution of La- Y 2 O 3 produced from Y 2 O 3 and an other oxide of La 2 O 3 . La 2 O 3 contains La, which has an ionic radius larger than Y 3+ , and is larger in basicity than Y 2 O 3 . The low adhesion material (3) contains La 2 O 3 at a predetermined ratio relative to a total of Y 2 O 3 and La 2 O 3 . The low adhesion material (3) thus has a large ionic radius contributing to a smaller number of sites per unit area than Y 2 O 3 , a larger basicity contributing to a smaller force binding the low adhesion material with a basic substance than Y 2 O 3 , and a ratio contributing to shape retention. The low adhesion material (3) thus less adhesive and more shape-retentive than Y 2 O 3 configures the molding surface (6). A low adhesion material that is less adhesive to a basic substance than Y 2 O 3 is and excellently shape-retentive, and an excellently releasable and shape-retentive resin molding die can thus be obtained. |
| priorityDate |
2006-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |