| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538 |
| filingDate |
2008-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_faa8cc88ed55a9e7e1ef4a3b26ef558e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55a02408e4ea77b19ef8b9030dea72d2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45a1e1bdb73baebac45ae2794026185b |
| publicationDate |
2008-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1962344-A1 |
| titleOfInvention |
Electronic device packages and methods of formation |
| abstract |
Provided are electronic device packages and their methods of formation. The electronic device packages include an electronic device mounted on a substrate, a conductive via and a locally thinned region in the substrate. The invention finds application, for example, in the electronics industry for hermetic packages containing an electronic device such as an IC, optoelectronic or MEMS device. |
| priorityDate |
2007-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |