| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0035 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0338
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0035 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate |
2008-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ca56c8e5a38bea188d4bf74e41cbb16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a596ff30171e10350970d7b0670edd28 |
| publicationDate |
2008-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1959479-A2 |
| titleOfInvention |
Electronic device manufacture |
| abstract |
New methods are provided for manufacturing a semiconductor device. Preferred methods of the invention include depositing a photoresist on a semiconductor substrate surface followed by imaging and development of resist coating layer; applying a curable organic or inorganic composition over the resist relief image; etching to provide a relief image of the resist encased by the curable composition; and removing the resist material whereby the curable organic or inorganic composition remains in a relief image of increased pitch relative to the previously developed resist image. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9640396-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2374145-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2374145-A2 |
| priorityDate |
2007-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |