| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b7317808024e524eea40a6c5a5ad6a22 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49124 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-84
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1214 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-77
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-84 |
| filingDate |
2006-11-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_197e4aaff9f59a3d55f1672e2acc1e4b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_775bfe0a1cdae0f3d3c6ca3878555522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0ade79c92391716dedc1c29c4db8ba3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12ba77d2a81aa3025ab457fa3836d81b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7838eb74b45df0bf12c9fab24abfeca8 |
| publicationDate |
2008-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1949433-A1 |
| titleOfInvention |
Method of manufacturing a plurality of semiconductor devices and carrier substrate |
| abstract |
Individual devices (100) are locally attached to a carrier substrate (10), so that they can be removed therefrom individually. This is achieved through the use of a patterned release layer, particularly a layer that is removable through decomposition into gaseous or vaporized decomposition products. The mechanical connection between the carrier substrate (10) and the individual devices (100) is provided by a bridging portion (43) of an adhesion layer (40). |
| priorityDate |
2005-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |