Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_60480587582bf8e0ca64c6076c0646ab |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-31742 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-3174 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-31744 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-0812 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-0815 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-31732 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-3142 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-006 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67069 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3178 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3056 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-305 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-317 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-08 |
filingDate |
2007-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71addffbe0a4cb8b78c58a229dd14743 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da6a66233b091672cce837f547611ad7 |
publicationDate |
2008-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-1918963-A2 |
titleOfInvention |
Charged particle beam processing using a cluster source |
abstract |
A cluster source producing a beam of charged clusters 108 is used to assist charged particle beam processing on a work piece 112. For example, a protective layer is applied using a cluster source and a precursor gas, the gas being supplied by a gas injection system 104. The large mass of the cluster and the low energy per atom or molecule in the cluster restricts damage to within a few nanometers of the surface of the work piece. Fullerenes or clusters of fullerenes, bismuth, gold or Xe can be used with a precursor gas to deposit material onto a surface, or can be used with an etchant gas to etch the surface. Clusters can also be used to deposit material directly onto the surface to form a protective layer for charged particle beam processing or to provide energy to activate an etchant gas. An additional charged particle beam 107 can assist in machining the work piece when e.g. a protective layer is applied. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7982196-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8877299-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113403572-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010117551-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8481340-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2899742-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2602808-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8592784-B2 |
priorityDate |
2006-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |