| abstract |
The present invention relates to an adhesive film comprising a polyimide resin (A) and a thermosetting resin (B), wherein the polyimide resin (A) comprises a polyimide resin having a repeating unit represented by a formula (I) shown below, and the storage elastic modulus of the adhesive film at 250°C, following heat treatment at a temperature of 150 to 230°C for a period of 0.3 to 5 hours, is not less than 0.2 MPa: n(wherein, the m R 1 groups each represent, independently, a bivalent organic group, the m R 1 groups include a total of k organic groups selected from the group consisting of -CH 2 -, -CHR- and -CR 2 - (wherein, R represents a non-cyclic alkyl group of 1 to 5 carbon atoms), m represents an integer of not less than 8, m and k satisfy a relationship: k/m ¥ 0.85, and R 2 represents a tetracarboxylic acid residue). |