| abstract |
Methods and apparatuses for improved thermal, electrical and/or mechanical performance in integrated circuit (IC) packages are described. An IC circuit package comprises a substrate (102) having a central opening (248). An IC die (118), resides within the opening in the substrate. Wirebonds (104) couple a plurality of bond pads (420) on a top surface of the IC die to a plurality of bond fingers on a top surface the substrate. An encapsulating material (108) encapsulates at least the IC die and the wirebonds such that at least a bottom surface (402) of the IC die is left exposed. The encapsulating material suspends the die such that at least a portion of the die is held within the opening in the substrate. |