Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0392 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-022 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 |
filingDate |
2007-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4fd220c8e594f4d931fdf5226b401ff4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44abe896688ed30a019a8ac9809792bf |
publicationDate |
2008-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-1906246-A2 |
titleOfInvention |
Photosensitive resin composition, production method of cured relief pattern using the same and semiconductor device |
abstract |
A photosensitive resin composition contains: a polymer represented by the formula (I) as defined herein, in which 0.5 mol% or more of A in the polymer represented by the formula (I) is a protective group; a photosensitizing agent; a compound containing a methacryloyl or acryloyl group within a molecule of the compound; and a solvent. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8697320-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102557945-A |
priorityDate |
2006-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |