http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1879223-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ee1c19da359446fb5c4f0458a57b783d http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_64ce9e67b090644ea50f977c57776a34 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate | 2005-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c5eb1c0b7c643981261b73beb12c0a10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_605892885a651799d15144e69f408008 |
| publicationDate | 2008-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-1879223-A1 |
| titleOfInvention | Composition for copper wiring polishing and method of polishing surface of semiconductor integrated circuit |
| abstract | To provide a technique for realizing high-precision surface planarization when copper is used as a wiring metal. n A polishing compound is used which comprises water; a peroxide oxidizer; a surface protective agent for copper; at least one first chelating agent selected from the group consisting of tartaric acid, malonic acid, malic acid, citric acid, maleic acid, oxalic acid and fumaric acid; and at least one second chelating agent selected from the group consisting of triethylenetetramine, ethylenediaminediacetic acid, ethylenediaminetetraacetic acid, tetraethylenepentamine, glycol-ether-diaminetetraacetic acid, trans-1,2-cyclohexanediaminetetraacetic acid, o-phenanthroline, and derivatives thereof. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/LT-6665-B |
| priorityDate | 2005-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 281.