| abstract |
A semiconductor package substrate (20) suitable for supporting a damage-sensitive device (21), comprising a package substrate core (14) having an upper and a lower surface (14a, 14b), at least one pair of metal layers (12a, 12b, 13a, 13b) coating said upper and lower surfaces (14a, 14b) of the package substrate core (14); one pair of solder mask layers (11a, 11b) coating the outer metal layers (12a, 12b) of the at least one pair of metal layers (12a, 12b, 13a, 13b); and a plurality of vias (19) formed across the package substrate core (14) and the at least one pair of metal layers (12a, 12b, 13a, 13b). Advantageously, the plurality of vias (19) is substantially distributed according to a homogeneous pattern in an area (21a) that is to be covered by the damage-sensitive device (21). n A method for the production of such semiconductor package substrate is also described. |