http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1877507-A2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_390ce1994f25efc27a636f44c0d3ec37 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J4-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-00 |
| filingDate | 2006-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ee31c952b3aac09e9fad24f76c5ff2f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4b03f67173f4836cae6a24fbe18eaa4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6c03a35de0be439e2c74ac13aceb026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce4a0f88409163ee406fd9532f351879 |
| publicationDate | 2008-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-1877507-A2 |
| titleOfInvention | Adhesive for metal bonding applications |
| abstract | Adhesive formulations having acrylate monomer or methacrylate monomer, or mixtures thereof, and having a reducing agent and an initiator (e.g., peroxide). The formulations may include a chelating agent solution to improve storage stability and other properties. Further, the mole ratio of the initiator to the reducing agent may be adjusted to control weight loss of the adhesives during cure. Polyvinyl acetate or its derivatives may also be employed in the adhesive formulations to reduce weight loss during cure. Moreover, certain embodiments of the formulations include a toughening- agent copolymer having a glass transition temperature (of at least one domain) that is lower than -50°C (-58°F). These toughening-agent copolymers may be added to the adhesive formulations to improve impact strength and other properties of the cured adhesives at lower temperatures, e.g., -40°C (-40°F), while maintaining performance of the cured adhesives at higher temperatures, e.g., 82°C (180°F). |
| priorityDate | 2005-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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