http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1861334-A1

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classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49105
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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-0023
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00
filingDate 2006-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28a07abab80afe082642288c2751517e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_afb498cfcd02efbaeadb19a8e358dafd
publicationDate 2007-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-1861334-A1
titleOfInvention Wafer level hermetically sealed mems device
abstract A hermetically sealed microelectromechanical system (MEMS) package includes a MEMS switch having a movable portion and a stationary portion with an electrical contact thereon. A glass lid is anodically bonded to the MEMS switch to form a sealed cavity over the movable portion of the MEMS switch. The glass lid includes a contact aperture to allow access to the electrical contact on the stationary portion of the MEMS switch. A family of body-implantable hermetically-sealed MEMS packages are provided according to certain aspects and embodiments of the present invention.
priorityDate 2005-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 27.