| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G16-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-20 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G61-02 |
| filingDate |
2006-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4281dc619e35902a12f44a577f96ad3a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_61009a2ac2b7c064cd4d807b445b9dcb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45206fa9221726350813a38c0c8b2dec |
| publicationDate |
2007-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1854819-A1 |
| titleOfInvention |
Epoxy resin composition, cured object obtained therefrom, semiconductor-encapsulating material, novel phenolic resin, and novel epoxy resin |
| abstract |
The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by -P-B-X-wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8741553-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023129137-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023129135-A1 |
| priorityDate |
2005-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |