Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-1089 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76852 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76862 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76837 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7682 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76874 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76871 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5283 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53209 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
filingDate |
2006-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0951ff354a86ce9d2d76f8a3685c18c2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd2e980544f1e7a6d4fe6a0b9e920816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc125a64842b94689f039e8d956052fd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_58c55c8a433fde54e93d7037d48817a8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_49d9859c24f1f104b469ccaca5304c3c |
publicationDate |
2007-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-1849187-A2 |
titleOfInvention |
Wiring patterns formed by selective metal plating |
abstract |
Conductive sidewall spacer stractures are formed using a method tiiat patterns structures (mandrels) and activates the sidewalls of the structures. Metal ions are attached to the sidewalls of the structures and these metal ions are reduced to form seed material. The structures are then trimmed and the seed material is plated to form wiring on the sidewalls of the structures. |
priorityDate |
2005-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |