Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c72d118f5664072de841f9c5c34b9d99 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31696 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31692 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31681 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31699 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G65-485 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-126 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G65-48 |
filingDate |
2000-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5135ce6fa01766d99800193b54aef57a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a6ecc664ac2043c1736a59777c11bfd |
publicationDate |
2007-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-1834975-A1 |
titleOfInvention |
Poly(Phenylene ether) - Polyvinyl thermosetting resin |
abstract |
A capped poly(phenylene ether) resin composition is formed from (1) a poly(phenylene ether) compound (PPE) in which at least a portion, preferably substantially all of the hydroxyl groups have been reacted with a compound containing ethylenic unsaturation (carbon-carbon double bonds) which is further reactive with unsaturated monomers (reactively endcapped PPE) and (2) a curable unsaturated monomer composition. The composition optionally contains a polymerization catalyst; a flame-retardant compound; and fibrous reinforcement. The composition can be cured to form a laminate, and clad with copper to form a circuit board. |
priorityDate |
1999-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |