| abstract |
A liquid thermosetting epoxy resin composition which comprises: a main ingredient comprising an alicyclic epoxy compound having in the molecule a cyclic aliphatic skeleton and two or more epoxy groups and a polyol oligomer having two or more terminal hydroxy groups; a hardener; and a hardening accelerator. Alternatively, the composition comprises the main ingredient and a hardening catalyst. The liquid thermosetting epoxy resin composition is free from the problem that hardening results in the generation of a part having a hardening failure. Consequently, a cured resin obtained by curing the liquid thermosetting epoxy resin composition is optically homogeneous and has a low flexural modulus, a high flexural strength, a high glass transition temperature, and high transparency. It is suitable for use in optical semiconductors, etc. |