| abstract |
An adhesive composition comprising 5 to 60 wt % of (A) a polyimidesilicone resin 5 to 60 wt % of (B) an epoxy resin having a softening point of 80° C. or lower, 0.001 to 20 wt % of (C) at least one epoxy resin curing catalyst selected from imidazole compounds and dicyandiamide 20 to 70 wt % of (D) spherical silica having an average diameter of 0.1 to 10 mum, and 5 to 30 wt % of (E) spherical fine particles of silicone rubber composite, wt % being based on a total weight of the composition. |