| abstract |
An integrated electronic device (X) includes a substrate (S), passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor (10A) provided on the substrate. The multi-stage coil inductor has a plurality of coils (11, 12) disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion (31) which extends on the substrate, a second wiring portion (32) which extends apart from but parallel to the substrate, and a third wiring portion (33) connecting the first wiring portion to the second wiring portion. |