Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8a16e2fa556744225f7c2bba36087e7f |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0387 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0233 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
filingDate |
2005-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60718ba155cf9daa67de795881b214a4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf0c8583f6813e73a4e8a859f02353fb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c75b5fb10d447b0259f69e8cffcff27d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e143d455a6823fe7e5ad0022e6311b99 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d249d60efb65be301c7314c66d5b971f |
publicationDate |
2007-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-1744213-A1 |
titleOfInvention |
Positive photosensitive resin composition, method for forming pattern, and electronic component |
abstract |
Provided is a positive photosensitive resin composition which is advantageous not only in excellent sensitivity, resolution and adhesion, but also in excellent heat resistance even when the composition is cured by a low-temperature process at equal to or lower than 280°C, as well as low water absorption and capability to give a pattern with favorable configuration. The positive photosensitive resin composition contains: (a) alkaline aqueous solution-soluble polyamide having a polyoxazole precursor structure; (b) an o-quinonediazide compound; and (c) a latent acid generator which generates acid upon heating. The composition optionally further contains (d) a compound having a phenolic hydroxyl group or (e) a solvent. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7615324-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2113810-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1970761-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2113810-A4 |
priorityDate |
2004-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |