| abstract |
A microfluidic architecture (10) is disclosed. The microfluidic architecture (10) includes a substrate (12) having an edge and a thin film stack (30, 130, 230, 330) established on at least a portion of the substrate (12) adjacent the edge. The thin film stack (30, 130, 230, 330) includes a non-conducting layer (37) and a seed layer (38), where the seed layer (38) is positioned such that a portion of the non-conducting layer (37) is exposed. A chamber layer (50, 150, 250, 350) is established on at least a portion of the seed layer (38). The non-conducting layer (37), the seed layer (38), and the chamber layer (50, 150, 250, 350) define a microfluidic chamber (70, 170, 370). A layer (54) having a predetermined surface property is electroplated on the chamber layer (50, 150, 250, 350) and on at least one of an other portion of the seed layer (38) and the exposed portion of the non-conducting layer (37). |