| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f76aab74ed312003383a8600e2edbd5b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ef85d661b9a18307a5a59ff4eca96233 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2433-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28F2013-006 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28F23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-04 |
| filingDate |
2005-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2c01dbfb1ed2d65a3858668443e872b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35960341eac362f6f24452b5cc5b805a |
| publicationDate |
2008-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1723197-A4 |
| titleOfInvention |
ADHESIVE COMPOSITION THERMOCONDUCTIVE IN TWO PARTS |
| abstract |
The present invention relates to a two part thermally conductive adhesive composition comprising: a first part comprising: a polymerisable monomer component which is (meth)acrylate based; a peroxide-based curing agent component; one or more co-curative components selected from: primary, secondary or tertiary amines or compounds containing the group -CONHNH-; a stabilising component; a thermally conductive filler component; and a second part comprising: a polymerisable monomer component which is acrylate or methacrylate based; a catalytic component for catalysing the cure reaction; a stabilising component; and a filler component wherein at least one part of the composition has a filler component which comprises a thermally conductive filler. The thermally conductive filler can be in the first part or the second part or both parts but is desirably in the second part. The compositions are useful for bonding heat generating components such as electrical components to a substrate such as a heat sink. |
| priorityDate |
2004-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |