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filingDate 2003-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2006-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-1695382-A1
titleOfInvention Thermal interface material and solder preforms
abstract A solder preform (5,12) having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. Among the fillers are CTE modifying components and/or a thermal conductivity enhancement components.
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