| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ebca25e4f737729fb927875476e58a9f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-40 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-3568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-359
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B28D5-0011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B28D1-221
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-53 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B28D1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B28D5-00 |
| filingDate |
2004-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c67b25f8c9245ce15b1a16cfab1a948
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aaed419972fc6274b9e80aee86977f20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0afacd6cd5af3b64d6800e1b5f84db51 |
| publicationDate |
2006-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1692719-A1 |
| titleOfInvention |
Semiconductor substrate assemblies and methods for preparing and dicing the same |
| abstract |
A method for forming semiconductor devices using a semiconductor substrate having first and second opposed surfaces and including first and second device regions includes directing a beam of laser light at the substrate such that the beam of laser light is focused within the substrate between the first and second surfaces thereof and the beam of laser light forms a thermally weakened zone (TWZ) in the substrate. The TWZ extends between the first and second device regions and defines a break line. |
| priorityDate |
2003-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |