| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_295d94453d856a2682d3dc030ebc408b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3612
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3478
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-282 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-0244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-0222
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-26 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C-
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C22-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C22-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-36 |
| filingDate |
2004-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94d8d49696b1b5e553fc385bd2d1d3ad |
| publicationDate |
2006-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1678340-A2 |
| titleOfInvention |
Surface reactive preservative for use with solder preforms |
| abstract |
A composition that reacts with and preserves the metal surface of a solder preform and the preserved solder preform are described. The surface preservative composition is compatible with the physical handling of solder performs and the requirements of the soldering process. The composition comprises a carrier, a surface reactive agent, an anti-static agent and a solvent. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101982288-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101982288-A |
| priorityDate |
2003-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |