| abstract |
A moisture-curable resin composition which comprises a curable resin having a silicon-containing characteristic group in the molecule and a curing catalyst which is either a Lewis acid selected from the group consisting of metal halides and boron halides or a complex of the Lewis acid. It quickly cures at ordinary temperature. The silicon-containing characteristic group is represented by the formula -SiX1X2X3 or -SiR1X1X2 (wherein X1, X2, and X3 may be the same or different and each represents a hydrolyzable group and R1 represents a C1-20 (un)substituted organic group). When the silicon-containing characteristic group is -SiR1X1X2, the curable resin further contains in the molecule a polar element which is a urethane bond, thiourethane bond, urea bond, thiourea bond, substituted urea bond, substituted thiourea bond, amide bond, sulfide bond, hydroxy, secondary amino, or tertiary amino. The ingredients can be formulated so as to constitute a two-pack type adhesive in which the curable resin and the catalyst for solidification are separately packed. |