| abstract |
In an IC card, an IC module (6) having an IC chip (3), a reinforcing structure (4) adjacent to the IC chip (3), and an antenna (5) is provided by use of adhesives (7,8). The IC chip (3) is curved such that it has a concave circuit surface (3a), and further, the IC chip (3) is fixed at its surface (3b) opposed to the circuit surface (3a) by use of the reinforcing structure (4) and a bonding agent (9), whereby the durability of the IC card can be improved and the external characteristic of the IC card can be improved at a high order. |