| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6a916e03e9b9d6e2e9655219cd75abb5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P2015-0814 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B3-0078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P15-0888
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P15-0802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P15-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P9-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L-
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P3-00 |
| filingDate |
2004-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a4a419f408bbd3806ef4a5d3662d9d4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c8bfac957e823262271dab186820dad3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ed4ac0cf2305e0d3f42f49e6c904309 |
| publicationDate |
2006-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1620257-A2 |
| titleOfInvention |
A method of adding mass to mems structures |
| abstract |
A proof mass (11) for a MEMS device is provided herein. The proof mass comprises a base (13) comprising a semiconductor material, and at least one appendage (15) adjoined to said base by way of a stem (21). The appendage (15) comprises a metal (17) or other such material that may be disposed on a semiconductor material (19). The metal increases the total mass of the proof mass (11) as compared to a proof mass of similar dimensions made solely from semiconductor materials, without increasing the size of the proof mass. At the same time, the attachment of the appendage (15) by way of a stem (21) prevents stresses arising from CTE differentials in the appendage from being transmitted to the base, where they could contribute to temperature errors. |
| priorityDate |
2003-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |