http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1597407-B1
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5ecf6095353e35606143b48b2ed8f12d |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02T50-60 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C4-185 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3491 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C4-134 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-3414 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C4-12 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C4-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C4-12 |
filingDate | 2004-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2011-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff73220a717cd1fc1a0a773c7b02436e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7aec63911b124192f81cb9f974110242 |
publicationDate | 2011-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | EP-1597407-B1 |
titleOfInvention | Process for the manufacture of a sputtering target |
abstract | A process for the manufacture of sputtering target comprises the steps of i) providing a substrate; ii) plasma melting of a material selected to form the sputtering target, yielding droplets of molten material; and iii) deposition of the droplets onto the substrate, yielding a sputtering target comprised of the coated layer of the material on the substrate. In some application, it might be preferable that the substrate be a temporary substrate and iv) to join the coated temporary target via its coated layer to a permanent target backing material; and v) to remove the temporary substrate, yielding a sputtering target comprised of the coated layer of the material on the permanent target backing material. The plasma deposition step is carried out at atmospheric pressure or under soft vacuum conditions using, for example, d.c. plasma spraying, d.c. transferred arc deposition or induction plasma spraying. The process is simple and does not require subsequent operation on the resulting target. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109440049-A |
priorityDate | 2003-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 43.