| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ff944e9291285045f742df09c49bac6a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-095 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-097 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 |
| filingDate |
2004-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4a3c95864157409e9e7c4623eff2709
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56a7b973d502bb138a61f360f43828a0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd8ed069dc1429a1884f79647279d7e7 |
| publicationDate |
2006-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1594929-A4 |
| titleOfInvention |
HIGH CONDUCTIVITY INKS WITH LOW MINIMUM CURING TEMPERATURES |
| abstract |
Conductive ink compositions which can be cured to highly conductive metal traces by means of 'chemical welding' include additives which reduce the curing temperatures for use with low-temperature substrates. Conductive ink compositions can be deposited on a substrate coated with a cure temperature reducing agent to reduce the curing temperatures. |
| priorityDate |
2003-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |