| abstract |
A fast curing composition that comprises a polymeric resin, a conductive filler and one ornmore near-infrared absorbing additives and optionally an oxygen scavenger or corrosion inhibitornor both, and other additives such as reactive or nonreactive diluents, inert fillers, and adhesionnpromoters. The composition may be conductive, resistive or anisotropically conductive. Innanother embodiment, this invention is a method for improving the cure speed of a composition bynexposing the composition to a near infrared energy source. |