| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b8be6a6c990669567cc455d32b00535e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-012 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5333
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-523
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4071
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5333
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-523
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate |
2003-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4168d1f749f951c05c56e3e22ee13c2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0747b7dbedbd5b7c04d7f4ba432cf44b |
| publicationDate |
2005-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1570000-A1 |
| titleOfInvention |
Epoxy resin composition containing reactive flame retardant phosphonate oligomer and filler |
| abstract |
The invention pertains to a process for curing an epoxy resin composition, wherein a reactive phosphonate is used as curing agent together with 0 to 20% by weight of the total composition of a co-curing agent. Preferably, the phosphonate is an oligomeric phosphonate comprising a repeating unit OP(O)(R)-O-arylene and having a phosphorous content greater than 12% by weight, wherein R is a lower alkyl and arylene is a radical of a dihydric phenol, which phosphonate is used together with 5 to 15% by weight of the total composition of the co-curing agent. The cured epoxy resin composition can be used for making an electronic substrate material, such as a printed wiring board. |
| priorityDate |
2002-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |