Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-189 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-284 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4614 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49833 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4857 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-186 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5387 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-69 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-34 |
filingDate |
2005-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d47eab4bbc235f5f9a30ef49d8be51ab http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a164e6543a83b4877c835cb71839199f |
publicationDate |
2005-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-1555862-A2 |
titleOfInvention |
Process for producing circuit board having built-in electronic part |
abstract |
The present invention provides a process fornproducing a circuit board (7) having built-in electronic parts (1),nwhich comprises the steps of: disposing two wiring circuitnboards (2) each having an electronic part (1) mounted thereon sonthat the electronic-part-mounting sides of the respectivencircuit boards (2) face each other; disposing a resin layer (3)nbetween the circuit boards (2); and press-bonding the resinnlayer (3) to the circuit boards (2). |
priorityDate |
2004-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |