| abstract |
A dicing die-bonding film has a supporting substrate (1), an adhesive layern(2) formed on the supporting substrate (1), and a die-bonding adhesive layer (3)nformed on the adhesive layer (2), and further has a mark for recognizing thenposition of the die-bonding adhesive layer (3). It is possible to provide a dicingndie-bonding film in which in the case where a semiconductor wafer and the dicingndie-bonding film are stuck onto each other, the position of the die-bondingnadhesive layer (3) in the film can be recognized. |