| abstract |
The invention provides a polyamide resin having a structurenrepresented by the formula (1), wherein 0.1 mol % to 30 mol %nof the total amount of Y in the formula (1) has a structurenrepresented by the formula (2), further a positive-workingnphotosensitive resin composition comprising a diazoquinonencompound, a method for producing a pattern-formed resin filmnusing the composition, a semiconductor device and a displayndevice using the composition, and a method for producing thensemiconductor device and the display device:n nwherein, X is an organic group of 2 to 4 valences; Y is an organicngroup of 2 to 6 valences; R 1 is a hydroxyl group or -O-R 3 whereinnm is an integer of 0 to 2; R 2 is a hydroxyl group, a carboxylngroup, -O-R 3 or -COO-R 3 wherein n is an integer of 0 to 4; R 3 nis an organic group having 1 to 15 carbon atoms;n nwherein, each of R 4 and R 5 is a divalent organic group; eachnof R 6 and R 7 is a monovalent organic group; n is an integer ofn0 to 20. |