| abstract |
The present application refers to a method of patterning organic materials or organic/inorganicnmaterials onto a substrate, comprising the following steps:n (1) patterning of a water-soluble material "A" onto a surface of the substrate,nthereby forming a substrate/material "A" surface; (2) depositing organic or organic/inorganic material "B" onto the substrate/materialn"A" surface; (3) lifting-off material "A" in aqueous solution; nwherein, step (1) comprises the following steps:n (1a) patterning of a photoresist material onto the substrate surface, thereby formingna substrate/photoresist material surface; (1b) depositing the water soluble material "A" onto the substrate/photoresist materialnsurface; (1c) lifting-off the photoresist material in an organic solvent; nor, alternatively, step (1) comprises the following steps:n (1a') depositing the water-soluble material "A" onto the substrate surface, therebynforming a substrate/material "A" surface; (1b') patterning the photoresist material onto the substrate/material "A" surface; (1c') etching the unmasked material "A" in aqueous solution; (1d') lifting-off the photoresist material in an organic solvent. n The present application also refers to the use of said method, to a pattern of organic materialsnor organic/inorganic materials prepared by said method, and to a substrate carrying such patterns.nThe application also refers to the use of a patterned nanoparticle film. |