| abstract |
In order to provide a low-cost and high heat-radiatingnelectronic circuit device featuring high compactness, littlenwarpage, high air tightness, high moldability, high mass productivity,nhigh reliability against thermal shocks, and highnoil-proof reliability, a module structure made by packing anwhole mulit-layer circuit board (1) which connects a semiconductornoperating element (7), semiconductor memory elementsn(8), and passive elements (9-12) thereon and part of a supportingnmaterial (3) on which said multi-layer circuit boardnis placed into a single package (4) by transfer-molding;nwherein said multi-layer circuit board and said supportingnmaterial are bonded together with a compound metallic materialn(2, 21) made up from copper oxide and at least one metalnselected from a set of gold, silver, and copper. |