| abstract |
A method for producing a semiconductor-moldingntablet, which can reduce formation of voids in the packagendue to increased density of the tablet. The methodncomprises a step of kneading an epoxy resin compositionncomprising components (A) an epoxy resin, (B) a phenolnresin, and (C) an inorganic filler as essentialncomponents, a step of roll-molding the resulting kneadedncomposition into a sheet shape having a sheet density rationof 98% or more, a step of pulverizing the resulting sheet-shapedncompact, and a step of forming the pulverizednmaterial into a tablet shape having a tablet density rationof 94% or more and less than 98%. |