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filingDate 2004-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2005-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-1494277-A2
titleOfInvention Module with a built-in semiconductor and method for producing the same
abstract In a module with a built-in semiconductor, higherndensification is achieved by disposing inner vias close tona semiconductor device. A module which has a space 107nbetween a first wiring layer 102a and a built-innsemiconductor device 105 is obtained by: mounting thensemiconductor device 105 on a first wiring layer 102a of anwiring board 103 without using a sealing resin; stacking onnthe circuit board an electrically insulating substratenhaving a through bore (inner via) 104 filled with anconductive paste and an opening for receiving thensemiconductor device, and a mold release carrier having ansecond wiring layer 102b in the stated order; and heatingnand pressurizing so that the semiconductor device 105 isnincorporated in a core layer 101 which is formed by curingnthe electrically insulating substrate.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1686628-A3
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1583160-A3
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3780075-A1
priorityDate 2003-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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