| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4edd4e526605dbd18b513b4b30d19ab2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02371
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/E05Y2800-41
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-06181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-06182
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/E06B3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06527
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05548
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06517
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06513
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/E06B7-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14806
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/E06B7-215 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-148
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 |
| filingDate |
2004-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f976d289b198194e1d008d9f85cf97af
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4722088709b8dcb959830ee6996c94ff
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c122002d3670e904892676b00b9207d |
| publicationDate |
2004-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1471571-A1 |
| titleOfInvention |
Semiconductor device and manufacturing method thereof |
| abstract |
A stacked MCM is manufactured at reduced cost without usingnexpensive apparatus. A first wiring (3A) and a second wiringn(3B) are formed on a surface of a semiconductor chipn(1) of a first semiconductor (100a) through an insulationnfilm (2). A glass substrate (4) having an opening (12) tonexpose the second wiring (3B) is bonded to the surface ofnthe semiconductor chip (1) on which the first wiring (3A)nand the second wiring (3B) are formed. A third wiring (9)nis disposed on a back surface and a side surface of thensemiconductor chip (1) through an insulation film (7) andnconnected to the first wiring (3A). And a conductive terminaln(11B) of another semiconductor device (100b) is connectednto the second wiring (3B) through the opening (12). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1686622-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8035215-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2048923-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8173543-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1884989-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8766408-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7935568-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1884989-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7807508-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008054660-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2048923-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008054660-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1840941-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1840941-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8102039-B2 |
| priorityDate |
2003-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |