| abstract |
Disclosed are electrolyte compositions for depositing a tin alloy on a substrate.nThe electrolyte compositions include tin ions, ions of one or more alloying metals, annacid, a thiourea derivative, and an additive selected from alkanol amines, polyethylenenimines, alkoxylated aromatic alcohols, and combinations thereof. Also disclosed arenmethods of depositing a tin alloy on a substrate and methods of forming an interconnectnbump on a semiconductor device. |