| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4fd9607748d2339b5bda6af3468f084b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L19-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F291-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F297-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L51-085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L53-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-26 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L19-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F297-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L53-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L51-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G81-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate |
2002-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2005-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42b6742ec7ffc90ceabafbfbe10fb7eb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cea90a0886e74f78037733d787d9d8db
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d1c9afabe4370907d27258a7aef237f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a5b788488a02291f5af7be1acbdb6c50 |
| publicationDate |
2005-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1458794-B1 |
| titleOfInvention |
Heat-curable resin composition |
| abstract |
The present invention relates to a resin composition comprising an at least bifunctional prepolymer (A) curable under the action of heat, a telechelic elastomer and a particulate material having an elastomeric core and a thermoplastic shell. Layers and patterns which are produced using the formulation according to the invention have excellent adhesion properties, chemical stability, good electrical properties and high resistance to rapid temperature ranges. The compositions are suitable in particular as solder resists in the production of circuit boards. |
| priorityDate |
2001-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |