http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1446452-B1

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filingDate 2002-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2006-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11e1827824e5d18bb1ab95ff6aaa3944
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2194d4ad11ba197cd706aebe2db21bb1
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publicationDate 2006-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-1446452-B1
titleOfInvention Modified epoxy resins
abstract The present invention relates to molding compositions comprising A) from 40 to 99% by weight of at least one epoxy resin, B) from 1 to 60% by weight of at least one polyarylene ether sulfone containing side- or end-groups selected from the group consisting of carboxy groups and anhydride groups, C) from 0 to 60% by weight of at least one polyarylene ether sulfone containing essentially no side- or end-groups selected from the group consisting of carboxy and anhydride groups, D) from 0 to 60% by weight of at least one filler, and E) from 0 to 40% by weight of one or more various additives, where the percentages by weight of components A to E together give 100%, and also to a process for preparing these molding compositions, and to their use, and to moldings obtainable therefrom.
priorityDate 2001-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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