| abstract |
Soldering flux compositions, solder pastes, and methodsnof soldering using the same are provided, that exhibitnexcellent wettability, give highly reliable solder joints,nand have superior storage stability. The flux compositionncontains at least one compound having at least one blockedncarboxyl group selected from the group including compoundn(X) obtained by reaction of a carboxylic acid compound andna vinyl ether compound, compound (Y) obtained by reactionnof a carboxylic acid anhydride compound and a hydroxy vinylnether compound, and compound (Z) obtained by reaction ofnan acid anhydride and a polyhydric alcohol, followed bynaddition polymerization with a divinyl ether compound, andnthe flux composition is non-curing. |