http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1433367-A2

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filingDate 2002-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7fbc163648334f9bec238a53307053eb
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publicationDate 2004-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-1433367-A2
titleOfInvention Anti-tombstoning structures and methods of manufacture
abstract A substrate, such as a printed board (PCB), has pairs of pads to which terminals of electronic components, such as capacitors, can be mounted. The pads have perimeters, for example, in the shape of rectangles, circles, or ovals. In one embodiment, to reduce asymmetrical, lateral, surface-tension forces that can cause the components to tombstone due to uneven heating of solder fillets on the pads during solder reflow, the edge of the perimeter of each pad opposite the inter-pad region contains one or more notches or indentations. Also described are an electronic assembly, an electronic system, and various methods of fabrication.
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Total number of triples: 23.