| abstract |
A plating apparatus (10) for plating a substraten(W). The apparatus (10) is provided with a plating unitn(20a to 20d), a substrate cleaning unit (22a, 22b), ansubstrate transport mechanism (TR) , a post-treatment agentnsupplying section (4), a minor constituent managingnsection (3) for managing minor constituents (annaccelerator, a retarder and chlorine) of a plating liquidnbeing used in the plating unit (20a to 20d), an enclosuren(30) which houses therein a substrate treating sectionn(1) including the plating unit (20a to 20d), the cleaningnunit (22a, 22b) and the substrate transport mechanism (TR) ,nand a system controller (155) for controlling the entirenapparatus. |